| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing accelerator useful for an epoxy resin, an epoxy resin having good curability, fluidizability and storage stability and a semiconductor device having an alloy cracking resistance and excellent anti-moisture reliability. SOLUTION: A curing accelerator for an epoxy resin comprises a compound of the structure shown by general formula (1) (wherein A<SP>1</SP>is a nitrogen atom or a phosphorus atom, R<SP>1</SP>to R<SP>4</SP>are each a substituted or unsubstituted organic or aliphatic group containing an aromatic ring or a heterocyclic ring, X<SP>1</SP>and X<SP>2</SP>are each an organic group, Y<SP>1</SP>and Y<SP>2</SP>, and Y<SP>3</SP>and Y<SP>4</SP>each form a chelating structure by binding with the above titanium atom, and at least one of Y<SP>1</SP>to Y<SP>4</SP>is one containing an ester linkage and the binding with the above titanium atom is conducted by the ester linkage, and Z<SP>1</SP>is a substituted or unsubstituted organic or aliphatic group containing an aromatic or heterocyclic ring). COPYRIGHT: (C)2007,JPO&INPIT
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