| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor, having such characteristics as to be good in hardenability and flowability and low in moisture permeability and capable of being suitably used for a CCD (charge coupled device), and to provide an optical semiconductor device for the CCD, given by using the composition, scarcely causing moisture condensation, and having high reliability of moisture resistance. SOLUTION: This epoxy resin composition for sealing the optical semiconductor contains (A) an epoxy resin, (B) a phenol resin, (C) a hardening accelerator, and (D) an inorganic filler as essential components, wherein at least one kind of porous material (d1) selected from silica gel, zeolite, and activated alumina having a specific surface area of not less than 10 m<SP>2</SP>/g and not more than 100 m<SP>2</SP>/g is contained in the epoxy resin composition as the inorganic filler. COPYRIGHT: (C)2007,JPO&INPIT
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