| 摘要 |
<P>PROBLEM TO BE SOLVED: To establish a method for patterning a protein supermolecule appropriately on a silicon substrate, and to provide a new semiconductor device employing protein by that method. <P>SOLUTION: In a semiconductor production process, the method for patterning protein including a metal on a semiconductor substrate comprises a step for forming a thin film of a charged material on a photoresist, a step for patterning the charged material, and a step for adsorbing supermolecules of protein including a metal to the charged material. Protein including a metal is patterned on a semiconductor substrate as a result of including steps for patterning a charged material, and adsorbing protein including a metal to the charged material. <P>COPYRIGHT: (C)2007,JPO&INPIT |
