| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device in which, when wiring formed on a board and wiring connected to the board through a step are formed, the disconnection of the connection of these wirings is prevented, connection reliability is enhanced, and a connection process between the wirings is simplified. <P>SOLUTION: This method comprises steps of forming first wiring 20 on a board 5, arranging a pedestal formed in a predetermined shape on the board 5, and connecting the pedestal to the first wiring 20 and forming second wiring 25 extending on the pedestal. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
