发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, AND SUBSTRATE FOR SEMICONDUCTOR GROWTH
摘要 PROBLEM TO BE SOLVED: To provide HEMT which has a small contact resistance between a source and a drain electrode and 2DEG (two-dimensional electron gas) and has a large electron density for 2DEG, by depositing an electron supplying layer and an electron traveling layer in a [000-1] direction. SOLUTION: The semiconductor device comprises the AlGaN electron supplying layer (32) whose thickness direction with respect to the surface of a substrate (30) is the [000-1] direction, the GaN electron traveling layer (34) formed on the electron supplying layer, a gate electrode (40) formed on the electron traveling layer, and the source electrode (42) and the drain electrode (44) which are formed on the electron traveling layer with the gate electrode in-between. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269534(A) 申请公布日期 2006.10.05
申请号 JP20050082308 申请日期 2005.03.22
申请人 EUDYNA DEVICES INC 发明人 KAWASAKI TAKESHI;NAKADA TAKESHI;YANO HIROSHI
分类号 H01L29/812;H01L21/338;H01L29/778 主分类号 H01L29/812
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