发明名称 AIRTIGHT STRUCTURE OF LOW-TEMPERATURE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an airtight structure of a low-temperature device capable of achieving sufficient airtightness even under a low-temperature condition and improving its durability. SOLUTION: In this airtight structure mounted on a part openably and closably partitioning the inside and outside of the low-temperature device kept at a low temperature, a seal plate 15 composed of a metallic plate spring is mounted inside of the low-temperature device, a soft packing 16 is mounted outside of the device, and the seal plate and the packing are pressed to contact faces and elastically deformed to keep airtightness of the part. Further the contact face of the packing is provided with a heater. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006266530(A) 申请公布日期 2006.10.05
申请号 JP20050082028 申请日期 2005.03.22
申请人 TAIYO NIPPON SANSO CORP 发明人 MAKINO KOJI;TAKEUCHI MASAHIRO;FUJITA MAMORU
分类号 F25D3/10;E06B7/22;F16J15/06;F25D23/02 主分类号 F25D3/10
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