发明名称 Shallow trench isolation formation
摘要 A method and structure for forming a semiconductor structure. A semiconductor substrate is provided. A trench is formed within the semiconductor substrate. A first layer of electrically insulative material is formed within the trench. A first portion and a second portion of the first layer of electrically insulative material is removed. A second layer of electrically insulative material is selectively grown on the first layer comprising the removed first portion and the removed second portion.
申请公布号 US2006220148(A1) 申请公布日期 2006.10.05
申请号 US20060445786 申请日期 2006.06.02
申请人 发明人 FURUKAWA TOSHIHARU;HAKEY MARK C.;HOLMES STEVEN J.;HORAK DAVID V.;KOBURGER CHARLES W.III
分类号 H01L29/76 主分类号 H01L29/76
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