发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND MEASURING METHOD THEREOF |
摘要 |
To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed. |
申请公布号 |
WO2006104019(A1) |
申请公布日期 |
2006.10.05 |
申请号 |
WO2006JP305889 |
申请日期 |
2006.03.17 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.;TSURUME, TAKUYA;ASANO, ETSUKO |
发明人 |
TSURUME, TAKUYA;ASANO, ETSUKO |
分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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