| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alignment method in a substrate exposure device for aligning without using an alignment mark, and a manufacturing method for a mask using this method. <P>SOLUTION: After mounting a substrate on the exposure device, a position and inclination of the substrate is calculated by measuring points on an outer periphery of the substrate, and an exposure pattern, and a position and inclination of the mask are corrected to exposure an arbitrary position on the substrate. Using this method, the pattern exposed by overlaying and the position and inclination of the mask are corrected by suiting to the position of the pattern previously exposed on the substrate, to expose by overlaying. Further in the overlay exposure, overlay exposure is performed on both surfaces of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
