| 摘要 |
PROBLEM TO BE SOLVED: To improve heat cycle resistance in a ceramics circuit board. SOLUTION: The ceramics circuit board 10 is provided with a ceramics substrate 11 and a metal plate M for circuit formation which is provided to the ceramics substrate 11 by a brazing material A. An angleθformed by a line g connecting an upper end M2 and a lower end M1 on the side wall of the end of the metal plate M and the upper surface MS of the metal plate M is regulated at 95°or more and less than 120°. In addition, the brazing material A is protruded outward from the lower end M1 of the metal plate M, thereby forming a brazing material extrusion part A1, and a migration preventive film is provided. COPYRIGHT: (C)2006,JPO&NCIPI |
