| 摘要 |
PROBLEM TO BE SOLVED: To decrease purge gas consumption so as to decrease liquid treatment cost in a technology that prevents treatment liquid from leaking from a treatment chamber by gas sealing that uses a purge gas or the like. SOLUTION: The liquid treatment apparatus that accommodates a wafer W in the chamber and performs liquid treatment and drying treatment on the wafer W therein, has a spindle 23a, that transmits the rotation driving force of a motor 23 to a rotor 24 so as to allow a hole section 88 to penetrate one wall surface of the treatment chamber, and a gas supply mechanism 85 supplies the purge gas into the treatment chamber through a gap section 89 so that the treating liquid does not leak to the outside through the section 89 between the periphery of the spindle 23a and the inside of the section 88. Here, a gas flow control mechanism 81 controls so that the supplied amount of the purge gas on which liquid treatment is performed is larger in quantity than that of the purge gas on which drying treatment is being performed. COPYRIGHT: (C)2006,JPO&NCIPI
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