| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive adhesive which is free of the problem that the conductive metal migrates when voltage is applied and which shows a low resistance. SOLUTION: The conductive adhesive comprises conductive particles and a resin, wherein the conductive particles comprises an alloy of silver and tin and further comprises an additive containing at least one of chelating agents, oxidation inhibitors and metal surface activators. As to the additive, for example, as the chelating agents, hydroxyquinolines, salicylidene amino thiophenols or phenanthrolines can be used, as the oxidation inhibitors hydroquinones or benzotriazoles can be used, and as the metal surface activators organic acids, acid anhydrides or organic acid salts can be used. COPYRIGHT: (C)2006,JPO&NCIPI
|
