| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a structure wherein a hollow portion is formed between a translucent member and an active element on a semiconductor substrate, without applying heavy load and conducting a pattern alignment at the jointing of the translucent member and the semiconductor substrate. <P>SOLUTION: In the semiconductor device 1, a spacer layer 17 is formed around an imaging element 12 on the semiconductor substrate 11, and a glass lid 15 is bonded to the spacer layer 17 via an adhesive layer 18. Thus, a space 16 is formed at a site, where the imaging element 12 is to be placed between the semiconductor substrate 11 and the glass lid 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
