| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for polishing a metal film of which the selectivity can be controlled to any value. <P>SOLUTION: The composition for polishing a metal film contains fumed silica as abrasive grains. The specific surface area of the fumed silica is not less than 50 m<SP>2</SP>/g nor more than 190 m<SP>2</SP>/g, and a half-value width in the particle size distribution is less than 0.1μm. By adjusting the specific surface area and the half-value width in the particle size distribution of the fumed silica within a predetermined range, the selectivity which is a ratio of a metal film polishing speed to an oxide film polishing speed can be controlled to any value. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
