| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of inspecting multi-chip package which can collectively inspect all of the sealed semiconductor integrated circuits, without increasing the number of external terminals. SOLUTION: A first semiconductor integrated circuit 60 writes arbitrary data onto a second semiconductor integrated circuit 70. Thereafter, when data reading control on the second semiconductor integrated circuit 70 is conducted, the same value as the expected data is outputted from the first semiconductor integrated circuit 60, allowing each data to collide with each other. At this time, leakage current in an internal bus part is measured; and if an operation is performed as the expected value, the leakage current will increase, when the same data collide with each other. If an operation that is not of expected value is performed, the leakage current will increase, when different data collide with each other; and the occurrence of operation failure can be inspected easily. COPYRIGHT: (C)2006,JPO&NCIPI
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