发明名称 MEMBER FOR LEAD-FREE SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a member for a lead-free soldering apparatus, the member which is composed of Fe-base alloy and is excellent in durability to lead-free solder, in particular, to Sn-Ag base lead-free solder in a molten state. SOLUTION: The member is composed of the Fe-base alloy having a composition consisting of 18-22% Ni, 16-22% Co, 18-25% Cr, 1-4% Mo, 1-4% W, 0.05-0.2% C, 0.5-2.0% Mn, 0.1-1.0% Si, 0.05-0.3% N and further, one or two kinds of 0.1-1.0% Ta and 0.1-1.0% Nb and further, if necessary, one or two or more among (a) 0.05-0.30% Al, (b) one or two of 0.005-0.040% La and 0.005-0.040% Zr, (c) 0.001-0.05% Mg, and the balance Fe with inevitable impurities. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006225695(A) 申请公布日期 2006.08.31
申请号 JP20050038633 申请日期 2005.02.16
申请人 MITSUBISHI MATERIALS CORP 发明人 SUGAWARA KATSUO
分类号 C22C38/00;B23K3/06;C22C38/58 主分类号 C22C38/00
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