发明名称 |
CONTINUOUS PARTIAL-PLATING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To surely and stably perform high positional precision partial-plating. SOLUTION: The device is provided with a rotary body having a carrier guide face and also capable of rotating with a base axis line as the center; and an electrode structure having a plurality of electrode nozzles separately arranged in the circumferential direction and also capable of jetting a power feed plating liquid from each electrode nozzle to the radial direction thereof. The range of the arranging angle in the electrode nozzles is selected narrower than the angular range at which a work is engaged with the carrier guide face of the rotary body, and the relative positions in the base axis direction of the rotary body and the electrode structure are formed so as to be holdable in a state where the plating liquid jetted from each electrode nozzle can be sprayed to each part requiring plating during continuous carrying. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006225677(A) |
申请公布日期 |
2006.08.31 |
申请号 |
JP20050037367 |
申请日期 |
2005.02.15 |
申请人 |
SANYU ENGINEERING KK |
发明人 |
KOBAYASHI KEISUKE;ITO YOSHIAKI;KOMIYAMA KIYOSHI |
分类号 |
C25D5/02;C25D5/08;C25D7/00;C25D17/00;C25D17/12 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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