发明名称 |
MOLD-RELEASABLE RESIN COMPOSITION, MOLD-RELEASABLE SHEET, MOLD-RELEASABLE FILM, AND PRESSURE-SENSITIVE ADHESIVE SHEET OR PRESSURE-SENSITIVE ADHESIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold-releasable resin composition suitable for extrusion lamination molding, excellent in mold releasability, and excellent in heat resistance, solvent resistance and adhesivity to substrates. SOLUTION: This mold-releasable resin composition comprises 99.99-70 wt.% polyolefin resin (A) and 0.01-30 wt.% block copolymer (B) of polydialkylsiloxane and one or more selected from the group consisting of polyimide, polyamide and polyester. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006225577(A) |
申请公布日期 |
2006.08.31 |
申请号 |
JP20050043589 |
申请日期 |
2005.02.21 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
NISHIZAWA OSAMU;OKUMURA HIROMICHI;KANEKO HIROYUKI;SEKI MOTOHIRO |
分类号 |
C08L23/00;B32B27/00;B32B27/32;C08J5/18;C08L83/10;C09J7/02;C09K3/00 |
主分类号 |
C08L23/00 |
代理机构 |
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主权项 |
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地址 |
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