发明名称 MOLD-RELEASABLE RESIN COMPOSITION, MOLD-RELEASABLE SHEET, MOLD-RELEASABLE FILM, AND PRESSURE-SENSITIVE ADHESIVE SHEET OR PRESSURE-SENSITIVE ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold-releasable resin composition suitable for extrusion lamination molding, excellent in mold releasability, and excellent in heat resistance, solvent resistance and adhesivity to substrates. SOLUTION: This mold-releasable resin composition comprises 99.99-70 wt.% polyolefin resin (A) and 0.01-30 wt.% block copolymer (B) of polydialkylsiloxane and one or more selected from the group consisting of polyimide, polyamide and polyester. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006225577(A) 申请公布日期 2006.08.31
申请号 JP20050043589 申请日期 2005.02.21
申请人 MITSUBISHI CHEMICALS CORP 发明人 NISHIZAWA OSAMU;OKUMURA HIROMICHI;KANEKO HIROYUKI;SEKI MOTOHIRO
分类号 C08L23/00;B32B27/00;B32B27/32;C08J5/18;C08L83/10;C09J7/02;C09K3/00 主分类号 C08L23/00
代理机构 代理人
主权项
地址