| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a TAB tape that reduces stresses generated in a bending direction and a width directions, when an insulated tape substrate is bent and mounted on a panel, etc. <P>SOLUTION: An insulated tape substrate 11 is provided with a pair of I/O terminals 14 and 15 that face in the length direction L, a device hole 16 and a lead 18 for connecting a semiconductor element electrode pad mounted on the device hole 16 and a pair of I/O terminals 14 and 15. In addition, bend sections A and B, at each of which the insulated tape substrate 11 is bent in the width direction W are formed with first long and thin slits 30, 31 in the width direction W and the insulated tape substrate 11 is formed with second long and thin slits 32 and 33 which are orthogonal to the first slits 30 and 31 as well as narrow and long in the direction L. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
