| 摘要 |
PROBLEM TO BE SOLVED: To provide a means of sufficiently ensuring mounting reliability of a surface mounted package even if the surface mounted package is miniaturized. SOLUTION: In the surface mounted package 10, a device chip 3 is placed on a flexible printed board 20 and the substrate is insulation-coated. The flexible printed board 20 has an insulating film 1 having drilled through-holes 5 and flat electrodes 6 for external connection formed to close the through-holes 5 on one surface of the insulating film 1. Each of the through-holes 5 exhibits a tapered shape of gradually extending from one surface 8 of the insulating film 1 to the other surface 9, and bumps 4 for internal connection to be electrically connected to the electrodes 6 are formed on the through-holes 5. Further, the device chip 3 is placed on the other surface 9 to the insulating film 1, and is electrically connected to the electrodes 6. COPYRIGHT: (C)2006,JPO&NCIPI |
