发明名称 Production method for chip-form film-forming component
摘要 To prevent a substrate and films from being deformed or damaged when a very large number of films are formed on a thin substrate. A multi-layer film block is formed on a thickness-increasing substrate and is divided into first optical multi-layer films with a lattice-form incision made in the block so as to be formed into respective chip-form film-forming components, and the surface, opposite to the surface on which the first optical multi-layer films are formed, of the substrate is polished to a level short of causing a deformation or a damage. A second optical multi-layer film such as an anti-reflection film is formed on the surface, opposite to the surface on which the first optical multi-layer films are formed, of a polished substrate base material so as to offset a stress by the films, and is cut.
申请公布号 US2006193974(A1) 申请公布日期 2006.08.31
申请号 US20050550018 申请日期 2005.09.23
申请人 FUJINON SANO CORPORATION 发明人 KURIHARA TADAYUKI
分类号 B05D5/06;C23C14/08;C23C14/24;G02B1/10;G02B1/11;G02B5/28 主分类号 B05D5/06
代理机构 代理人
主权项
地址