METALLIC PATTERN FORMING METHOD, METALLIC PATTERN, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a metallic pattern forming method capable of forming a minute metallic pattern without performing an etching process, the metallic pattern which is excellent in bonding properties with a substrate, has sufficient conductivity, and has small unevenness on an interface with the substrate. SOLUTION: The method successively has (a) a process of providing a polymer having a functional group interacting with a non-electrolytic plating catalyst or its precursor like a pattern on the substrate; (b) a process of causing the pattern to absorb the non-electrolytic plating catalyst or its precursor; and (c-1) a process of applying non-electrolytic plating processing to the substrate having the polymer layer by using a non-electrolytic plating liquid containing plating catalyst poison of 1×10-10to 1×10-4mmol/l, and forming a metallic film like a pattern; or (c-2) a process of applying non-electrolytic plating processing to the substrate having the polymer layer while adding the plating catalyst poison into a non-electrolytic plating liquid, so that the concentration of the plating catalyst poison is in a range of 1×10-10to 1×10-4mmol/l and forming a metallic film like a pattern. COPYRIGHT: (C)2006,JPO&NCIPI