| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing die bond tape by which direct die bonding of a semiconductor element is possible by easily separating the semiconductor element and an adhesive layer from a pressure sensitive adhesive for using in the case of pick up. SOLUTION: The base material film whose rupture elongation is≤500% and whose rupture strength is 10 to 40 MPa is used, and the base material film contacting with the pressure sensitive adhesive is ethylene vinyl acetate copolymer. Thus, cutting property in the case of dicing is improved. COPYRIGHT: (C)2006,JPO&NCIPI |
