RESIN COMPOSITION, RESIN LAYER, CARRIER MATERIAL WITH RESIN LAYERS AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which has excellent electric characteristics and gives a resin layer for a circuit board having a good adhesion to the base material and can have micro via holes created by laser, also to provide a carrier material and a circuit board with the resin layer having excellent electric characteristics and a good adhesion to the base material and can have micro via-holes created by laser. SOLUTION: The resin composition constitutes an insulating layer of a circuit board with via-holes created by laser and is characterized by containing a polymer alloy consisting of a cyclic olefin-based resin and a polyimide resin. The above resin composition also contains an inorganic filler. The resin layer 3 is characterized by comprising the above resin composition. The carrier material 1 is characterized by the above resin layer 3 formed on at least one side of a carrier material 2. The circuit board is characterized by having the above resin layer. COPYRIGHT: (C)2006,JPO&NCIPI