| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of rigid-flex printed wiring board of the structure where an internal layer substrate and an external layer substrate are laminated via a bonding member and peeling generated between the bonding member and internal layer substrate can be suppressed. SOLUTION: The manufacturing method of rigid-flex printed wiring board comprises at least a processαfor conducting alkaline process to both external surfaces of the internal layer FPC 30 and a processβfor respectively laminating the external layers RPC 50A and 50B to both external surfaces of the internal layer FPC30 to which the alkaline process is implemented via the bonding members 40A and 40B. COPYRIGHT: (C)2006,JPO&NCIPI |
