| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for etching which is capable of sufficiently increasing the adhesive strength of a plated layer on a resin molding having sufficient performance usable as a car component, and which is used for the electroless plating considering the safety during a work at site and the effect on the environment by waste water. SOLUTION: The composition for etching a resin molding formed of resin elements containing styrene-based resin and polyamide-based resin consists of aqueous solution containing 0.1-10 g/l surfactant, 20-600 g/l inorganic acid and 0.1-50 g/l organic acid. COPYRIGHT: (C)2006,JPO&NCIPI |
