发明名称 |
Apparatus and method for manufacturing copper clad laminate with improved peel strength |
摘要 |
The present invention relates to an apparatus and method for manufacturing a copper clad laminate, which can achieve a substantial improvement in the peel strength between a thermoplastic liquid crystal polymer and a copper foil. The apparatus comprises: a coating means for thinly coating the surface of a copper foil with a thermoplastic liquid crystal polymer solution; a solvent removal means for drying the coated liquid crystal polymer solution to remove the solvent of the coated solution; and a thermal pressing means for laminating and thermally pressing a thermoplastic liquid crystal polymer film onto the copper foil using heating rolls so as to make a copper clad laminate.
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申请公布号 |
US2006124228(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20050297831 |
申请日期 |
2005.12.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SANG Y.;SHIN JOON S.;PARK HYUNG W.;YUN GEUM H. |
分类号 |
B29C65/02;B29D99/00;B32B27/00 |
主分类号 |
B29C65/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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