发明名称 Apparatus and method for manufacturing copper clad laminate with improved peel strength
摘要 The present invention relates to an apparatus and method for manufacturing a copper clad laminate, which can achieve a substantial improvement in the peel strength between a thermoplastic liquid crystal polymer and a copper foil. The apparatus comprises: a coating means for thinly coating the surface of a copper foil with a thermoplastic liquid crystal polymer solution; a solvent removal means for drying the coated liquid crystal polymer solution to remove the solvent of the coated solution; and a thermal pressing means for laminating and thermally pressing a thermoplastic liquid crystal polymer film onto the copper foil using heating rolls so as to make a copper clad laminate.
申请公布号 US2006124228(A1) 申请公布日期 2006.06.15
申请号 US20050297831 申请日期 2005.12.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE SANG Y.;SHIN JOON S.;PARK HYUNG W.;YUN GEUM H.
分类号 B29C65/02;B29D99/00;B32B27/00 主分类号 B29C65/02
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