LAMINATE FOR PRINTED WIRING BOARD

摘要

This invention provides a laminate for a printed wiring board having a laminate structure comprising an electrical insulator layer (A) and an electrical conductor layer (B) bonded directly to each other. The electrical insulator layer (A) is formed of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer containing an acid anhydride residue and a polymerizable unsaturated bond. The proportion of each repeating unit based on the repeating units((a) + (b) + (c)) is 50 to 99.89% by mole for (a), 0.1 to 49.99% by mole for (b), and 0.01 to 5% by mole for (c). In the electrical conductor layer (B), the surface roughness of the face in contact with the electrical insulator layer (A) is not more than 10 µm. The laminate for a printed wiring board is excellent in signal response in a high frequency region.