| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a substrate joining structure that can reduce the effects of noises without narrowing a components mounting space with no need of fixing screws and without increasing a spaced distance between an upper substrate and a lower one. <P>SOLUTION: This is a substrates joining structure that interconnects substrate wiring formed on respective mutually facing surfaces 13a and 15a of an upper substrate 13 and a lower one 15 in parallel spaced by a gap 11 which is equipped with a wall 17 provided in the gap 11; a conductor formed on the side of the wall 17 that makes the substrate wiring conductive as well as being fixed to respective substrate wiring; an electronic component 25 mounted on the facing surfaces 13a and 15a; and a sheet metal member 21 that is fitted into a holding groove formed on the wall 17 to enclose the electronic component 25, provides a plated layer 23 that is formed inside the holding groove and on other sides of the wall 17 where the conductor is not formed, and is made conductive with the sheet metal member 21 to have the same electrical potential as that of the sheet metal member 21, thus enclosing the electronic component 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
