| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase resistance to a crack of a case, and detachment of a board when force of bending is applied to an IC card, so as to improve durability. <P>SOLUTION: A recessed part 20 of the case 12 fitting on an LGA 18 is formed with first protrusions 28 and second protrusions 30. The second protrusion 30 is connected to a side wall 20A on a card center side of the recessed part 20. Because the recessed part 20 is formed with a gap between a bottom part and the LGA 18, i.e., the first protrusions 28 and the second protrusions 30 keeping a thickness of adhesive 32 constant and proper, the LGA 18 and the case 12 can be certainly bonded. Because the second protrusions 30 formed in the bottom part of the recessed part 20 are integrally connected to the side wall 20A though a boundary portion to a thick portion on the card center side of the recessed part 20 is a portion on which stress is easy to concentrate and wherein the crack is easy to generate, they become reinforcement of the boundary portion, and relax the stress concentration to suppress generation of the crack from the boundary portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
