| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and the manufacturing method thereof improved in reliability, even when the laser marking of a thin type package is effected. SOLUTION: The semiconductor device is constituted of a device body 10 equipped with a semiconductor chip 13 mounted on the island 11 of a lead frame 18, and a metal fine wire 14 electrically connecting the internal electrode 17 of the semiconductor chip 13 and the external lead unit 12 of the lead frame 18, while the device body 10 is molded by a mold resin 15. Further, the product information of the device body 10 is marked in a marking region 16 on the surface of the mold resin 15 at a side with the semiconductor chip 13 mounted thereon except the summit 14a of curvature of the metal fine wire 14. COPYRIGHT: (C)2006,JPO&NCIPI |
