| 摘要 |
PROBLEM TO BE SOLVED: To split a substrate after forming an internal crack by laser beam processing so that there is no remainder by the split along a predetermined line on the surface. SOLUTION: In the substrate splitting method, surface processing scars 11a are formed in a substrate surface 11; at the time of splitting a substrate 10 into an element chip 10a by external force, the back of the substrate 10 and a cylindrical stage 61 with a curved surface 64 are pressed so that the substrate 10 is transformed in imitation of the curved surface 64 of the cylindrical stage 61; the crack generated by the surface processing scar 11a as a starting point is made to interconnect with an internal crack 12, so that the substrate surface 11 is split along splitting predetermined lines C. COPYRIGHT: (C)2006,JPO&NCIPI |
