| 摘要 |
PROBLEM TO BE SOLVED: To reduce a parts count of a thermoelectric apparatus package to hold a thermoelectric module to control temperature of a high-power semiconductor device, and to provide the package assembled simply and easily. SOLUTION: The package includes a package main body formed by integrating a frame part 21a to have a box shape sidewall and a base part 21b to be a bottom board of the frame part 21a. In a central part of the base part 21b is formed a recess part 21g to mount the thermoelectric module 15. A step part formed around the recess part 21g has a plurality of internal electrodes c2 (d2, e2, f2, g2, h2) to electrically connect to the semiconductor device or the thermoelectric module 15. The frame part 21a or the base part 21b has a plurality of external electrodes to electrically connect to an outer circuit. The package main body is composed of a multilayered substrate, and is provided with wiring to connect the internal electrodes and the external electrodes embedded in the multilayered substrate. COPYRIGHT: (C)2006,JPO&NCIPI |
