| 摘要 |
PROBLEM TO BE SOLVED: To enable a contact load to be secured surely and durability to be realized in use of an order of several hundred-thousand times, even in the case of using a thinner vertical coil spring probe. SOLUTION: A vertical coil spring probe A is provided, which comprises; an upper side probe pin 100 having an upper side probe pin connecting section 110 connected to a conductive pattern 610 of an intermediate substrate 600 making up a probe card; a lower side probe pin 200 having a lower side probe pin connecting section 210 which contacts with a conductive pad 710 of a semiconductor integrated circuit 700 being an object to be measured; a first compression coil spring 300 which is interposed between the probe pins 100, 200; and a conductive second compression coil spring 400 which is interposed between the probe pins 100, 200 and positioned inside the first compression coil spring 300. COPYRIGHT: (C)2006,JPO&NCIPI
|
