| 摘要 |
PROBLEM TO BE SOLVED: To provide a high pressure liquid injection type cutting device capable of correctly cutting an object to be cut in a chip shape, and supporting a cut substrate on a chip without using any adhering means to fix the object to a supporting member when cutting a second channel of the object. SOLUTION: The high pressure liquid injection type cutting device 10 divides an object 20 to be cut into a plurality of chips C by cutting a first channel and a second channel of the object 20 by a high-pressure liquid injected from a high pressure liquid injection means 16. The device has a plate-like supporting member 30 having a projection part 32 to be engaged with a cut groove 20a formed in the object 20 by cutting the first channel, and the second channel is cut by injecting the high-pressure liquid 168 while the projection part 32 is engaged with the cut groove 20a, and the object 20 with the first channel cut therefrom is supported by the supporting member 30. COPYRIGHT: (C)2006,JPO&NCIPI
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