发明名称 |
Enhanced wafer cleaning method |
摘要 |
A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.
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申请公布号 |
US2006124153(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20050061944 |
申请日期 |
2005.02.17 |
申请人 |
LAM RESEARCH CORP. |
发明人 |
YUN SEOKMIN;BOYD JOHN M.;WILCOXSON MARK |
分类号 |
C23G1/00;B08B3/00;B08B3/10;B08B3/12;H01L21/00 |
主分类号 |
C23G1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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