PRINTED BOARD AND PRINTED BOARD MANUFACTURING METHOD

摘要

A printed board which efficiently cools an electronic component while not requiring a heat sink for cooling the electronic component and suppressing size increase of the electronic component, and a method for efficiently manufacturing such printed board. Since carbon layer part which is mainly composed of carbon and has excellent heat conductivity is arranged in layers inside or on the surface of an insulating material part, heat generated from the electronic component due to a current applied is transmitted to the carbon layer part, diffused in the carbon layer part and then dissipated to the external. Thus, when the electronic component generates heat due to the current applied, heat generated by the electronic component can be surely dissipated by heat conduction to the carbon layer part and heat diffusion at the carbon layer part, and the electronic component can be cooled at a high efficiency.