| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, including a semiconductor chip connected to a substrate by wire-bonding, and a plurality of individual components provided on the substrate capable of high dense mounting and size reduction. <P>SOLUTION: A second semiconductor chip 130 is supported on a substrate 101 by the largest-height individual component 125 among a plurality of components within a region D. Other components, lower than the component 125, are provided on the substrate 101 located farther outside of a first semiconductor chip mounting region G and farther inside a second connection pad 106. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
