| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method which, with a relatively simple construction, can surely fill in via holes or the like with a metal film without the formation of voids in the embedded metal film even when the via holes or the like have a high aspect ratio and a deep depth. SOLUTION: The plating apparatus comprises:a plating tank 186 for holding a plating solution 188; a holder 160 for holding an object W to be plated, feeding electricity to the object to be plated, and bringing a surface to be plated of the object to be plated into contact with the plating solution in the plating tank; an anode 214 disposed in the plating solution in the plating tank; a plating solution stirring section 220, 224, disposed between the anode and the object to be plated held by the holder, for stirring the plating solution in the plating tank; and a plating power source 230 for periodically applying a voltage between the object to be plated and the anode; wherein the plating solution is stirred by the plating solution stirring section when no voltage is applied between the object to be plated and the anode, whereas the stirring of the plating solution by the plating solution stirring section is stopped when the voltage is applied between the object to be plated and the anode. COPYRIGHT: (C)2006,JPO&NCIPI
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