| 摘要 |
A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing ( 10 ) surrounds an electrically insulating substrate ( 40 ) with metal connection tracks ( 41 ) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components ( 50 ) disposed on them. The housing has a cap ( 14 ) and at least one framelike housing part ( 12 ) forming the side walls thereof. This housing part ( 12 ) includes a main frame ( 120 ) and at least one locking frame ( 130 ). The main frame ( 120 ) has guides ( 122, 128 ) for receiving connection elements ( 30, 32 ). The locking frame ( 130 ) is disposed relative to the main frame ( 120 ) such that it rests at least in part on the connection tabs ( 310, 320 ) of the connection elements ( 30, 32 ), in order to prevent movemnt of the connection elements toward the substrate ( 40 ).
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