发明名称 |
Multi-layered circuit board and manufacturing method of multi-layered circuit board |
摘要 |
There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.
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申请公布号 |
US2006127652(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20050297358 |
申请日期 |
2005.12.09 |
申请人 |
KANAYA YASUHIKO;IRIE AKIRA;NAGASAWA KATSUHIRO;YUKI TORU |
发明人 |
KANAYA YASUHIKO;IRIE AKIRA;NAGASAWA KATSUHIRO;YUKI TORU |
分类号 |
B32B3/10;B32B3/00;B32B18/00;C04B35/64 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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