发明名称 Systems to cool multiple electrical components
摘要 According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first contact surface and a second electrical component coupled to transmit heat to the second contact surface.
申请公布号 US2006126294(A1) 申请公布日期 2006.06.15
申请号 US20040009173 申请日期 2004.12.10
申请人 FANEUF BARRETT;ALDRIDGE TOMM 发明人 FANEUF BARRETT;ALDRIDGE TOMM
分类号 H05K7/20 主分类号 H05K7/20
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