Interconnects having a recessed capping layer and methods of fabricating the same

摘要

Apparatus and methods of fabricating an interconnect having a recessed capping layer. An embodiment of the present invention relates to the fabrication of an interconnect for a microelectronic device which includes a recessed capping layer, which substantially eliminates topography issues present in the known devices and provides improved encapsulation of the interconnect to prevent electromigration of the conductive material thereof.