| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic part loading substrate, etc. which can diffuse the heat generated from an electronic part more efficiently. <P>SOLUTION: The electronic part loading substrate 1 is formed of metal plates 2 and 3, a ceramic material in the front surface of the plate 2, an insulating material layer 4 in which a exothermic IC 5 is formed in the front surface, and a heat transfer member 80 provided in the front surface of the IC 5. Accordingly, the heat generated by the IC 5 is transferred to the insulating material layer 4 and the plates 2 and 3 through the heat transfer member 80, and diffused to the exterior. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
