HEAT SINK MATERIAL, METHOD FOR MANUFACTURING SUCH HEAT SINK MATERIAL, AND SEMICONDUCTOR LASER DEVICE

摘要

A heat sink material, which is composed of an alloy or a composite material including two or more kinds of elements and is provided with at least an end plane by which an edge part can be formed for mounting a laser element. A method for manufacturing such heat sink material, and a semiconductor laser device provided with such heat sink material are also provided. The heat sink material (10) is composed of the alloy or the composite material including two or more kinds of elements, has a relatively large area main surface and a relatively small area sub-surface intersecting the main surface. The sub-surface includes a surface to which electro-discharge machining is performed by arranging discharge wire (200) substantially parallel to the main surface. The method for manufacturing the heat sink material (10) is provided with a step of arranging the discharge wire (200) substantially parallel to the main surface on materials (100, 50), and a step of performing the electro-discharge machining to the materials (100, 50) by using the discharge wire (200) arranged as mentioned above.