MIKROELEKTRONISCHE KONTAKTSTRUKTUR UND HERSTELLUNGSVERFAHREN DAZU

摘要

The contact provides a micro-miniature spring contact for mounting active semiconductor devices. The structure comprises a resilient spring contact (100) with one end (102) being a base end which is mounted to an electronic component. The other end (104) is a "free end" tip which provides a pressure connection to another electronic component. The structure is steeped with the base end at one height and with the free end at second height. There is a central portion (106) between the two end portions and which is at a third height. Thus there are two steps in the structure which performs as a cantilever beam.