| 摘要 |
<p>The present invention provides a phenol resin composition which does not cause any defect such as blister in a reflow step and which are excellent in flame resistance and stamping properties, and a phenol resin copper-clad laminate in which the above composition is used. The invention relates to a phenol resin composition which is obtainable by blending a melamine-modified phenol novolak resin with a phosphate ester, an epoxy resin and a dry oil-modified phenol resin, and also relates to a phenol resin copper-clad laminate which is obtainable by impregnating paper-based sheets with the above phenol resin composition, drying them to obtain prepregs, superimposing the prepregs on each other, and then a laminating copper foil on the outermost layer of the prepregs.</p> |
