发明名称 |
Circuit device construction |
摘要 |
An apparatus includes a device chip having circuit elements fabricated on a substrate and a cap covering at least a portion of the device chip including the circuit elements such as thin film resonators. The placement of the cap on the device chip is sealed using a gasket having treaded surface for improved adhesion, cold weld deformation of gold, and decreased susceptibility to foreign particles resulting in a superior seal. |
申请公布号 |
GB2396055(B) |
申请公布日期 |
2006.06.14 |
申请号 |
GB20030024538 |
申请日期 |
2003.10.21 |
申请人 |
AGILENT TECHNOLOGIES, INC. |
发明人 |
FRANK S GEEFAY |
分类号 |
H01L23/10;H01L23/29;H01L23/04;H01L23/31 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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