A thermal interface material and methods for preparing the same are disclosed. The thermal interface material comprises a copper mesh and a slurry. The copper mesh is impregnated and coated with the slurry. The slurry comprises a liquid metal alloy mixed with a plurality of thermal conductive particles. The methods include methods for preparing the thermal interface material, preparing the slurry, preparing the mesh, preparing the device for receiving the material, and for applying the thermal interface to the device.
申请公布号
WO2005053021(A3)
申请公布日期
2005.08.04
申请号
WO2004US38999
申请日期
2004.11.19
申请人
HEAT TECHNOLOGY, INC.;LARSON, RALPH, I.;PROULX, ROBERT, J.