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发明名称
EPOXY MOLDING COMPOUND FOR SEALING OF SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100504604(B1)
申请公布日期
2005.08.04
申请号
KR19990011822
申请日期
1999.04.06
申请人
发明人
分类号
H01L23/08;(IPC1-7):H01L23/08
主分类号
H01L23/08
代理机构
代理人
主权项
地址
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